Removed and cleaning of oxidation layer from metal coating
< Cleaning by solvent >
<Cleaning by clean & coating material>
Coating surface after cleaning
=>Challenge to missing ball and trouble zero by cleaning of PCB Pad and Ball surface
Basis explanation of cleaning & coating process(IC Frame)
Generally, Cu(Copper)or mental is gone oxidation according to time, temperature and oxidation layer is produced
General Cu(IC) Frame
Oxidation Cu(IC) Frame
Deleted oxidation layer Cu(IC) Frame
General descaling must do flux processing and solder is spread
skynics’s cleaning & coating without flux processing is excellently spreaded than existing spreadability
Descaling -> solder dipping
Descaling -> flux -> solder dipping
Clean & coating -> solder dipping
Descaling processing is gone much oxidation after bake(150’c 15min).
clean & coating processing sample was hardly gone oxidation
Bake after descaling
Bake after clean & coating
The result of solder dip test, Clean and coating processing sample appeared satisfactory results after bake
Generally, Cu(Copper)or mental is gone oxidation according to time, temperature and oxidation layer is produced
